Shandong Senspil electronic technology Co., Ltd is a Hi-tech enterprise, devoting to advanced integrated circuit and MEMS sensors packaging and test. Senspil’s core business would include IC and MEMS sensors packaging and test, engineering sample processing and package prototype development.
Senspil has a highly specialized technical team committed to the development of advanced packaging techniques and customization of production solutions, which can satisfy small and medium batch packaging requirements as well as the steadily growing needs of IC &MEMS applications. Our business partners include wafer Fab, IC design cooperation, product solution integrator, scientific research institute/colleges and universities and packaging industry customers.
Senspil should provide the most flexible and creative solutions to explore and cope with the challenges brought by various types of packaging mode in IOT (Internet of Things) and Internet markets. And our fast service would help reduce the operating cost of our customers effectively.